Autumn Meeting of the Japan Society of Powder and Powder Metallurgy, 2022

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Special Interest Session » Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Suppression of Thermal Expansion by Negative Thermal Expansion Materials

Wed. Nov 16, 2022 3:05 PM - 4:15 PM Room II (Clover Hall)

Chairperson:Koshi TAKENAKA(Nagoya University)

3:05 PM - 3:25 PM

[2-45] Invited Talk: Thermal stress control by using negative thermal expansion filler for higher performance three-dimensional integrated circuit

*Hisashi Kino1 (1. Tohoku University)

Keywords:Negative thermal expansion, Three-dimensional integrated circuit, Thermal stress

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