Development of low-temperature sintering nano Ag particle pastes for power semiconductor device bonding

Presentation information

General Session » Electronic Materials and Solid Electrolyte

Thu. May 26, 2022 11:10 AM - 12:25 PM Room III (2F, Room 201)

Chairperson:Naohito TSUJII(National Institute for Materials Science (NIMS)), Takeshi WAKI(Kyoto University)

11:10 AM - 11:25 AM

〇Koji Sasaki¹, Masashi Kajita¹ (1.NAMICS CORPORATION)

Keywords:Nano Ag particle, Low temperature sintering, Bare Cu substrate, Pressure sintering

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