*Chen-Nan SUN¹, Wai Jack SIN¹, Guglielmo VASTOLA², N. SRIDHAR², Mui Ling Sharon NAI¹ (1. Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology, and Research (A*STAR)(Singapore), 2. Institute of High Performance Computing (IHPC), Agency for Science, Technology, and Research (A*STAR)(Singapore))

Shinnosuke KUSAKAWA¹, Masahiro ARAKI², Kazuhiro NAKAMURA², Makiko YONEHARA¹, Toshi-Taka IKESHOJI¹, *Hideki KYOGOKU¹ (1. Kindai University(Japan), 2. TRAFAM(Japan))

*Takahiro KIMURA¹, Takayuki NAKAMOTO¹, Kazuki SUGITA², Masataka MIZUNO², Hideki ARAKI² (1. Osaka Research Institute of Industrial Science and Technology(Japan), 2. Osaka University(Japan))

*Naoyuki NOMURA¹, Takato KOUSAKA¹, Shinichi MORIYA², Takayuki NAKAMOTO³, Takahiro KIMURA³, Keiko KIKUCHI¹, Akira KAWASAKI¹ (1. Tohoku University(Japan), 2. Japan Aerospace Exploration Agency(Japan), 3. Osaka Research Institute of Industrial Science and Technology(Japan))

*Shinichiro Sato¹, Shin Mizutani¹, Yuta Koike¹, Daichi Yamaguchi¹, Takafumi Sasaki¹ (1. RICOH COMPANY, LTD.(Japan))

*Shinji Sakamoto¹, Msayuki Matsui¹, Takahiro Komatsu¹, Yoshinori Ito, katsuhiko Sakai, Hiroo Shizuka (1. Nissei Electric Co.(Japan))