Presentation information

一般講演

鍛造Ⅱ

Fri. Nov 18, 2022 10:50 AM - 12:30 PM 第3会場

座長:金秀英

11:30 AM - 11:50 AM

[308] Change in Bonding Characteristics by Dimple Treatment in Forge-Bonding with Torsion

*松本良¹, 橋本翔², 宇都宮裕³ (1.阪大, 2.阪大・院, 3.阪大)

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