Session 21: Ultra-short pulse laser processing 3 (Drilling, Cutting)

Thu. Jun 15, 2023 9:20 AM - 11:00 AM Room 1 (2F Meeting Room #3)

Session Chairs:Mizue Mizoshiri(Nagaoka University of Technology, Japan,)

9:20 AM - 9:40 AM

[R1-S21-1] High-quality laser cutting of heat-sensitive polymer materials using femtosecond laser pulses
[Student presentation]

*Evaldas Kažukauskas^1,3, Arnas Vyšniauskas^2,3, Valdemar Stankevič^2,3 (1. Laser Research Center, Faculty of Physics, Vilnius University, Sauletekio Ave. 10, LT-10223 Vilnius, Lithuania (Lithuania), 2. Center for Physical Sciences and Technology, Savanoriu Ave. 231, LT-02300 Vilnius, Lithuania (Lithuania), 3. Akoneer, Mokslininku st. 6B, LT-08412 Vilnius, Lithuania (Lithuania))

9:40 AM - 10:00 AM

[R1-S21-2] Ultrahigh Speed Femtosecond Laser Fabrication of Numerous Glass Micro-chambers for Molecular Analysis

*Jiawei Zhang¹, Kotaro Obata¹, Koji Sugioka¹ (1. RIKEN (Japan))

10:00 AM - 10:20 AM

[R1-S21-3] Material and ultrashort pulse laser parameters influencing the ablation quality of multi-layer thin film systems

*Astrid Sassmannshausen¹, Semjon Mooraj², Martin Kratz³ (1. Chair for Laser Technology - RWTH Aachen University (Germany), 2. Saint-Gobain Sekurit Deutschland GmbH (Germany), 3. Fraunhofer Institute for Laser Technology (Germany))

10:20 AM - 10:40 AM

[R1-S21-4] Initial stage of Si processing using single pulse of NIR fs-laser

*Masahito Katto¹, Masanori Kaku¹, Yuji Sato², Masahiro Tsukamoto², Atsushi Yokotani¹ (1. University of Miyazaki (Japan), 2. Osaka University (Japan))

10:40 AM - 11:00 AM

[R1-S21-5] Femtosecond laser cutting of 110-550 µm thickness borosilicate glass in ambient air and water

Laimis Zubauskas¹, Edgaras Markauskas¹, Gediminas Raciukaitis¹, *Paulius Gecys¹ (1. Center for Physical Sciences and Technology (FTMC) (Lithuania))

Session information

Session 21: Ultra-short pulse laser processing 3 (Drilling, Cutting)

[R1-S21-1] High-quality laser cutting of heat-sensitive polymer materials using femtosecond laser pulses
[Student presentation]

[R1-S21-2] Ultrahigh Speed Femtosecond Laser Fabrication of Numerous Glass Micro-chambers for Molecular Analysis

[R1-S21-3] Material and ultrashort pulse laser parameters influencing the ablation quality of multi-layer thin film systems

[R1-S21-4] Initial stage of Si processing using single pulse of NIR fs-laser

[R1-S21-5] Femtosecond laser cutting of 110-550 µm thickness borosilicate glass in ambient air and water

Authentication

Session information

Session 21: Ultra-short pulse laser processing 3 (Drilling, Cutting)

[R1-S21-1] High-quality laser cutting of heat-sensitive polymer materials using femtosecond laser pulses[Student presentation]

[R1-S21-2] Ultrahigh Speed Femtosecond Laser Fabrication of Numerous Glass Micro-chambers for Molecular Analysis

[R1-S21-3] Material and ultrashort pulse laser parameters influencing the ablation quality of multi-layer thin film systems

[R1-S21-4] Initial stage of Si processing using single pulse of NIR fs-laser

[R1-S21-5] Femtosecond laser cutting of 110-550 µm thickness borosilicate glass in ambient air and water

Authentication

[R1-S21-1] High-quality laser cutting of heat-sensitive polymer materials using femtosecond laser pulses
[Student presentation]