The 24th International Symposium on Laser Precision Microfabrication (LPM2023)

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Oral Presentation

Oral Presentations

Session 15: Micro-welding

Wed. Jun 14, 2023 2:10 PM - 4:00 PM Room 3 (1F Meeting Room ＃1)

Session Chairs:Markus Kogel-Hollacher(Precitec, Germany)

2:40 PM - 3:00 PM

[R3-S15-2] Direct bonding of semiconductors by through-transmission laser welding

*Pol Sopeña1, Andong Wang2, Alexandros Mouskeftaras1, David Grojo1 (1. Aix-Marseille Université, CNRS, LP3 (France), 2. University of Oxford, Department of Engineering Science (UK))

Keywords:laser welding, laser processing, wafer bonding, semiconductors, silicon

C000030

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