Session information

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一般講演セッション

[6] 有機／無機（接合）１

座長：重藤暁津(物質・材料研究機構)　

[6-24] Examination of Non-Destructive Analysis of Metal / Plastics Dissimilar Material Bonding by Injection Molding

一般講演

^○Takashi NAGAOKA (大成プラス株式会社)

[6-25] The Influence of Film Forming Condition on Bonding of Resin to Copper Substrate through C-H-Si Thin Film

一般講演

^○Yuka YAMADA, Shinji FUKUMOTO, Kozo FUJIMOTO (大阪大学大学院工学研究科)

[6-26] Fabrication of Alumina Nano Textures for Understanding The Polymer Infiltration in Metal-polymer Hybrid Joining

速報論文

^○Hao CHANG, Fuminobu KIMURA, 1 Yusuke KAJIHARA (東京大学)

[6-27] Effect of Laser Irradiation on Aluminum Alloy-Resin Dissimilar Material Joining

速報論文

^○Makoto HINO, Ryohei SHINNO, Ryoichi KUWANO (広島工業大学大学院)

[6-28] Influence on resin/metal interface strength by formation of convex shape of substrate surface using cold spray method.

速報論文

^○辻直生¹,小倉翔太郎¹,松嶋道也¹, 藤本公三¹,福本信次¹ (1.大阪大学)