[1] 接合信頼性

[1-5] Fatigue Life Prediction of BGA Solder Joint under Combined Thermal and Vibration Loading Incorporating Strength Degradation due to Microstructural Coarsening in Service Conditions

一般講演

^○Kouichi MOROOKA¹, Yoshiharu KARIYA² (1.芝浦工業大学大学院, 2.芝浦工業大学工学部)

Keywords:BGAはんだ接合部、疲労寿命予測、熱・振動複合負荷、組織粗大