[11] ナノ・マイクロマテリアル

[11-51] Development for Non-Pressure Process in Silver Sintering Die Attach of Power Device

一般講演

^○Junichiro MINAM, Masatoshi OKUDA, Ryo KATO, Suguru HASHIDATE, Takamichi MORI, Tetsuo SAKURAI, Taro FUKUI (株式会社 大阪ソーダ)

Keywords:無加圧接合、銀焼結