[17] ソルダリング２

[17-80] Effect of Added Element on Microstructure and Fatigue Properties of Sn-Sb-Ag High Temperature Lead Free Solder

一般講演

^○Mizuki YAMAMOTO¹, Ikuo SHOHJI¹, Tatsuya KOBAYASHI¹, Kohei MITSUI², Hirohiko WATANABE^1,2 (1.群馬大学大学院理工学府, 2.富士電機(株))

Keywords:Sn-6.4Sb-3.9Ag、Ni添加、疲労特性、EBSD解析