[7] 有機／無機（接合）２

[7-30] Mechanism of Low Cycle Fatigue Crack Extension Along an Interface Between Molding Resin and Metallic Substrate in Power Devices

一般講演

^○Yuta TAKAHASHI¹, Genki NAGAO¹, Toru IKEDA¹, Masaaki KOGANEMARU¹, Takeshi KAKARA², Takuya HATAO² (1.鹿児島大学, 2.住友ベークライト株式会社)

Keywords:パワーデバイス，き裂進展，機械的疲労試験，界面はく離，パリス則