リサイクル

[3211-22-02] Recovery of Gold and Copper from Resin-molded IC Chip

^○Yonggu KIM¹, Toyohisa Fujita¹, Gjergj Dodbiba¹, Josiane Ponou¹, Akitake Honda² (1. The University of Tokyo, 2. Matsuda Sangyo Co., Ltd. )

司会: 篠田弘造（東北大学）

Keywords:Recycling

Scrap of resin-molded IC chip contains gold and copper. In this study, Experimental processes of recovering gold and copper from resin-molded IC chip was designed. Sample analysis by TG-DTA showed calcination should be done at over 550ﾟC. Result of crushing sample showed cutter mill was better crushing method than jaw crusher. Leaching of calcined sample by using aqua regia shows recover of gold is done.