リサイクル

[3211-22-02] 樹脂モールド付きチップからの金と銅の選択的回収

^○金 容九¹、藤田 豊久¹、ドドビバ ジョルジ¹、ポヌ ジョジアヌ¹、本多 暁威² (1. 東京大学、2. 松田産業)

司会: 篠田弘造（東北大学）

キーワード：リサイクル

Scrap of resin-molded IC chip contains gold and copper. In this study, Experimental processes of recovering gold and copper from resin-molded IC chip was designed. Sample analysis by TG-DTA showed calcination should be done at over 550ﾟC. Result of crushing sample showed cutter mill was better crushing method than jaw crusher. Leaching of calcined sample by using aqua regia shows recover of gold is done.