[SY-I7] Atomistic Investigation on Interaction of Stress-Assisted Grain Boundary Motion with Crack
Stress-assisted grain boundary motion is a prominent phenomenon in crystalline materials. On the other hand, crack/voids are common features in physical materials, thus the interaction of a moving grain boundary mediated by stress with such features are important to study the microstructural evolution of crystalline materials under severe plastic deformation. In this work three major behaviors are studied using atomistic simulations when a stress-mediated moving grain boundary interacts with crack, i.e., crack healing, crack propagation and sub-grain formation. The underlying macromechanism is described using atomistic configurations for each case and the effect of loading type, i.e., monotonic or cyclic is described. It is shown that metastable phases are the main reason for crack heal-ability of grain boundaries. The effect of material type which is in terms of stacking fault energy is also explored.