The 9th International Conference on Multiscale Materials Modeling

Presentation information

Symposium

O. Tribology and Interface: Multi-Scale, Multi-Physics, and Multi-Chemistry Phenomena in Friction, Lubrication, Wear, and Adhesion

[SY-O2] Symposium O-2

Mon. Oct 29, 2018 3:45 PM - 5:30 PM Room5

Chairs: Mark Owen Robbins(Johns Hopkins University, United States of America), Tasuku Onodera(Hitachi, Ltd., Japan)

[SY-O2] Diffusion of a Cu nanodroplet on an amorphous carbon surface

Yong-Long Chen1, Yu-Chen Chiu1, Kai Chen2, Yu-Chieh Lo1 (1.National Chiao Tung University, Taiwan, 2.Xi'an Jiaotong University, China)

Due to better electrical and thermal conductivity, copper (Cu) nanowires are promising material for the application in the next-generation transparent conductors, integrated circuits. Recently, there have been few reports on the discovery of single-crystalline metal nanowires growing on a carbon substrate. It is noteworthy that on amorphous carbon substrates the most productive growth of Cu nanowire can be achieved. The development of such a direct process is important and attractive for the production of Cu nanowires. Amorphous carbon films play an important role in the production of Cu nanowires. However, the influence of amorphous carbon films on Cu still remains unclear. According to our research, because of the roughness of amorphous carbon surface, Cu atoms are difficult to diffuse on an amorphous carbon film. Nevertheless, Cu can diffuse on amorphous carbon surface with the form of cluster. To confirm this, we conducted molecular dynamics (MD) simulations to explore cluster diffusion behaviors of nanoscale Cu on various carbon films with different morphology. The surface effects, including surface roughness and sp2/sp3 bond ratio of carbon films. The aim of this work is to understand cluster diffusion of nanoscale Cu on the amorphous carbon films in order to find out the optimal controlling factors for the formation of Cu nanowires.