[F3-PR15] Slot 15

[F3-PR15-01] Bath Stability of Electroless NiSnP Plating using Ni(OH)₂ as Ni Metal Source

*Tetsuya Kanno^1,2,4, Yasushi Umeda^2,3, Hideo Honma², Osamu Takai², Katsuhiko Tashiro^2,3 (1. Graduate School of Engineering, Kanto Gakuin Univ. (Japan), 2. Material and Surface Engineering Res. Inst., Kanto Gakuin Univ. (Japan), 3. Res. Advancement and Management Organization, Kanto Gakuin Univ. (Japan), 4. Pure Co., Ltd. (Japan))

Keywords:NiSnP, Ni(OH)2, High Sn Content, Deposition Rate, Bath Stability