*Kungwan Kang¹, Fumiaki Kato², Akitoshi Nakano², Ichiro Terasaki², Hyoungjeen Jeen³, Hiromichi Ohta¹ (1. Hokkaido Univ. (Japan), 2. Nagoya Univ. (Japan), 3. Pusan National Univ. (Korea))

*Keiji Kobayashi¹, Simon Moore¹, Philipp Sauerschnig², Michihiro Ohta², Masanobu Miyata¹, Mari Takahashi¹, Shinya Maenosono¹ (1. Japan Advanced Institute of Science and Technology (Japan), 2. National Institute of Advanced Industrial Science and Technology (Japan))

*Shunya Sakane^1,2, Kazuki Munakata², Yusuke Morikawa², Haruhiko Udono¹, Hideki Tanaka² (1. Ibaraki Univ. (Japan), 2. Chuo Univ. (Japan))

*Koji Miyazaki¹, Ajay Kumar Baranawal³, Qing Wang¹, Kosuke Watanabe¹, Asuka Miura², Tomohide Yabuki², Satoshi Iikubo¹, Qing Shen³, Shuzi Hayase³ (1. Kyushu Univ. (Japan), 2. Kyushu Inst. of Tech. (Japan), 3. The Univ. Electro-Comm. (Japan))

*Ahrong Jeong¹, Zhiping Bian², Hiromichi Ohta¹, Byung-Koog Jang³ (1. Research Institute for Electronic Science, Hokkaido University (Japan), 2. Graduate School of Information Science and Technology, Hokkaido University (Japan), 3. Interdisciplinary Graduate School of Engineering Sciences, Kyushu University (Japan))

*alfonso Cebollada¹, Andres Conca¹, Jose Maria Dominguez-Vazquez¹,Olga Caballero-Calero¹, Marisol Martin-Gonzalez¹ (1. Instituto de Micro y Nanotecnología, IMN-CNM, Isaac Newton 8, 28760 Tres Cantos. (Spain))

*Masahiro Goto¹, Michiko Sasaki^1,2 (1. NIMS (Japan), 2. The Univ. of Tokyo (Japan))

*Francesco Rossella¹ (1. University of Modena and Reggio Emilia (Italy))