Dismantlable Adhesion Interface Featuring Stimulus-Responsive Chemical Bond Change

Presentation information

Oral Session

E. Softmatter » [E-1] Precise Material Science for Degradation and Stability

Fri. Dec 15, 2023 4:30 PM - 6:30 PM Session 2 (Room C-2)

Chair: Yoshinori Takashima (Osaka Univ.)

5:00 PM - 5:30 PM

*Miho Aizawa¹ (1. Tokyo Tech. (Japan))

Keywords:Adhesion technology, Dismatling, Molecular layer, Interface, Stimulus-responsive

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