Improving durability of copper sinter bonding under thermal aging using redox reaction between cuprous oxide nanoparticles and polyethylene glycol

Presentation information

Poster Session

G. Process » [G-2] Advances in materials and processing with/for 3D manufacturing

Fri. Dec 15, 2023 6:30 PM - 8:30 PM Poster (Annex)

*Tomoki Matsuda¹, Shio Okubo¹, Seigo Yamada¹, Makoto Kambara¹, Akio Hirose¹ (1. Osaka University (Japan))

Keywords:Copper sinter bonding, Microscale tensile test, Oxidation, Redox reaction, Thermal aging

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