MRM2023/IUMRS-ICA2023

Presentation information

Print

Oral Session

G. Process » [G-3] Joining and Welding for Advanced Materials

[G3-O502] Oral 502

Fri. Dec 15, 2023 2:00 PM - 4:00 PM Session 17 (Room 509)

Chair: Hiroshi Nishikawa (JWRI, Osaka University)

2:00 PM - 2:30 PM

[G3-O502-01 (Symposium Keynote)] Low Temperature In-bearing Solders for Microelectronic Applications

*C Robert Kao Kao1 (1. National Taiwan University (Taiwan))

Keywords:solders, packaging, low temperature, indium

Please log in with your participant account.
» Participant Log In