Investigating Thermomigration in Cu/Sn3.5Ag/FeCoNiMn Solder Joint

Presentation information

Oral Session

G. Process » [G-3] Joining and Welding for Advanced Materials

Fri. Dec 15, 2023 2:00 PM - 4:00 PM Session 17 (Room 509)

Chair: Hiroshi Nishikawa (JWRI, Osaka University)

2:55 PM - 3:20 PM

*Yu-An Shen¹ (1. Feng Chia University (Taiwan))

Keywords:Thermomigration, Solder joints, Diffusion barrier, Multielement intermetallic compound, High-entropy alloy

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