Power module packaging technologies of wide band-gap power semiconductors

Presentation information

Oral Session

G. Process » [G-3] Joining and Welding for Advanced Materials

Fri. Dec 15, 2023 4:30 PM - 6:30 PM Session 17 (Room 509)

Chair: Yu-An Shen (Feng Chia University)

4:50 PM - 5:10 PM

*Dongjin Kim¹ (1. Korea Institute of Industrial Technology (KITECH) (Korea))

Keywords:WBG power semiconductor, Ag sintering, Thermal characterization

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