[WD2] III-V and Hybrid Active Devices

[WD2-3] Compact InP MZM Optical Sub-Assembly with Built-in Electrical Filters by Three-Dimensional Packaging Technique

〇Fukiko Hirose, Keita Mochizuki, Junichi Suzuki, Shusaku Hayashi, Yosuke Suzuki, Kiyotomo Hasegawa (Mitsubishi Electric Corporation, Japan)

Keywords:Packaging technology of photonic devices and circuits, Optical modulators

We developed compact InP-based MZM sub-assemblies with built-in electrical filters by using flip-chip bonding technique. We realized the E/O response at -3 dB of 41 GHz and EVM of 14.9% for 50 Gbaud QPSK modulation.