[WD2] III-V and Hybrid Active Devices

[WD2-3] Compact InP MZM Optical Sub-Assembly with Built-in Electrical Filters by Three-Dimensional Packaging Technique

〇Fukiko Hirose, Keita Mochizuki, Junichi Suzuki, Shusaku Hayashi, Yosuke Suzuki, Kiyotomo Hasegawa (Mitsubishi Electric Corporation, Japan)

キーワード：Packaging technology of photonic devices and circuits, Optical modulators

We developed compact InP-based MZM sub-assemblies with built-in electrical filters by using flip-chip bonding technique. We realized the E/O response at -3 dB of 41 GHz and EVM of 14.9% for 50 Gbaud QPSK modulation.