SLPC2024 » Oral Presentation

Ultrashort Pulsed Laser Processing

Tue. Apr 23, 2024 1:15 PM - 3:00 PM 416+417 (Pacifico Yokohama Conference Center)

Session Chair: Masaki Hashida (Tokai University), Masahito Katto (University of Miyazaki)

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1:15 PM - 1:45 PM

[SLPC3-01(Invited)] Ultra-Short Pulsed Laser Ablation of Metals with Burst Pulses: Concepts, Opportunities and Misconceptions

*Beat Neuenschwander¹, Stefan M. Remund¹, Daniel J. Foerster² (1. Institute for Applied Laser, Photonics and Surface technologies ALPS, Bern University of Applied Sciences, Switzerland, 2. LightPulse LASER PRECISION, Germany)

1:45 PM - 2:00 PM

[SLPC3-02] Fabrication of diffraction gratings in glass and in-process monitoring of its diffraction beam

Yuta Nakamura¹, Satoshi Hasegawa¹, *Yoshio Hayasaki¹ (1. Utsunomiya University)

2:00 PM - 2:15 PM

[SLPC3-03] Laser processing of transparent materials for laser wakefield electron accelerators

*Gediminas Raciukaitis¹, Migle Mackeviciute¹, Juozas Dudutis, Valdemar Stankevič¹, Mehdi Abedi-Varaki, Valdas Girdauskas¹, Paulius Gečys¹, Vidmantas Tomkus¹ (1. FTMC - Center for Physical Sciences and Technology)

2:15 PM - 2:30 PM

[SLPC3-04] Stable LIPSS formation on transparent materials by data-driven ultrashort pulse laser processing based on optical in-process monitoring

*Aiko Narazaki¹, Daisuke Nagai^1,2, Takemichi Miyoshi^1,2, Hideyuki Takada¹, Dai Yoshitomi¹, Godai Miyaji² (1. National Institute of Advanced Industrial Science and Technology (AIST), 2. Tokyo Univ of Agriculture and Technology)

2:30 PM - 2:45 PM

[SLPC3-05] Ultrafast laser cleaving of ultra-thin glass and polymers

*Bogusz Stępak¹, Natalia Grudzień¹, Rafał Smolin¹, Yuriy Stepanenko¹, Michał Nejbauer¹ (1. Fluence)

2:45 PM - 3:00 PM

[SLPC3-06] On-Machine Measurement Using Optical Interferometry in Holographic Laser Processing

*Ren Umetsu¹, Yoshio Hayasaki¹, Satoshi Hasegawa¹ (1. Utsunomiya University)

Session information