Bonding Technology & ATLA Project - 3

[TILA-LIC8-01(Invited)] Surface Activated Bonding for 3D and Heterogenous Integration at Room Temperature

*Tadatomo SUGA¹ (1. Meisei University)

The current status and future challenges of surface-activated bonding, a low-temperature bonding technology for 3D and heterogeneous integration, will be reviewed. It is expected to contribute to the three-dimensional integration as well as to solving heat dissipation problems in photonic and high-power devices.