09:00 〜 09:30
[TILA-LIC8-01(Invited)] Surface Activated Bonding for 3D and Heterogenous Integration at Room Temperature
The current status and future challenges of surface-activated bonding, a low-temperature bonding technology for 3D and heterogeneous integration, will be reviewed. It is expected to contribute to the three-dimensional integration as well as to solving heat dissipation problems in photonic and high-power devices.
要旨・抄録、PDFの閲覧には参加者用アカウントでのログインが必要です。参加者ログイン後に閲覧・ダウンロードできます。
» 参加者用ログイン