Temperature distribution simulations in Cr:LiSAF DFC chip for high power broadband tiny integrated laser in 800-950 nm range

Florent Cassouret

Presentation information

TILA-LIC2024 » Oral Presentation

Bonding Technology & ATLA Project - 3

Fri. Apr 26, 2024 9:00 AM - 10:30 AM 315 (Pacifico Yokohama Conference Center)

Session Chair: Hideki ISHIZUKI (RIKEN SPring-8 Center, Sayo-gun, Japan)

10:15 AM - 10:30 AM

[TILA-LIC8-05] Temperature distribution simulations in Cr:LiSAF DFC chip for high power broadband tiny integrated laser in 800-950 nm range

*Florent Cassouret¹, Takunori Taira^1,2 (1. Institute for Molecular Science, 2. RIKEN SPring-8 center)

Thermal distribution calculation on new designed Cr:LiSAF DFC chip shows 4 times lower temperature compared to bulk crystal under 100W-diode pumping which could lead to over 40W output power.

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