Poster(Material Science and Applied Engineering 2)

[M-P2-02] Intermetallic Layer Formation in Sn-Cu Solders with Rice Husk Ash (RHA) As Reinforcement through Laser Soldering Method (C000019)

*Azmah Hanim Mohamed Ariff^1,2, T.T. Dele-Afolabi¹, Ong Zi Jiang¹ (1. Department of Mechanical and Manufacturing Engineering, Faculty of Engineering, Universiti Putra Malaysia, 43400 UPM Serdang Selangor, Malaysia., 2. Advance Engineering Materials and Composites Research Center, (AEMC), Faculty of Engineering, Universiti Putra Malaysia, 43400 UPM Serdang Selangor, Malaysia.)

Keywords:Sn-Cu solder joints, IMC layer, laser soldering, rice husk ash