一般セッション
General Session » Adhesion, bonding, and secondary processing
Wed. Nov 29, 2023 9:30 AM - 10:50 AM Room G (Meeting room)
座長:佐藤 公俊(国士舘大学)
9:30 AM - 9:50 AM
*Seiichi Sai1 (1. Mutsuki Electric Co., Ltd.)
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9:50 AM - 10:10 AM
*Weiyan Chen1, Fuminobu Kimura1, Yusuke Kajihara1 (1. The University of Tokyo)
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10:10 AM - 10:30 AM
*Fuminobu Kimura1, Yusuke Kajihara1 (1. The University of Tokyo)
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10:30 AM - 10:50 AM
*Wei Zhao1, Jianhui Qiu, Eiichi Sakai, Haonan Wu, Andong Pan, Jianhua Tang (1. Akita Prefectural University)
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