Poster
Thu. Sep 28, 2023 3:00 PM - 4:30 PM Meeting Room1
Chair: Shunsuke Koba (Kobe City Col. Tech.), Hideki Minari (Sony Semiconductor Solutions)
*Rutger Duflou1,2, Michel Houssa1,2, Aryan Afzalian1 (1. imec, 2. KU Leuven)
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*Youngrok Kim1, Chihak Ahn2, Alexander Schmidt1, Joohyun Jeon1, Sae-Jin Kim1, Hakseon Kim1, Hyunjae Kim1, Hyeyoung Kwon1, Yero Lee1, Sung Jin Kim1, Dongjin Lee1, Jaeduk Lee1, Dae Sin Kim1 (1. Samsung Electronics Co., Ltd., 2. Samsung Semiconductor Inc.)
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Sabine Leroch1, *Robert Stella1, Andreas Hössinger2, Lado Filipovic1 (1. University of Technology Vienna, 2. Silvaco Ldt Europe)
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*Haruhide Miyagi1, Ulrik G. Vej-Hansen2, Brad A. Wells2, Jan-Niclas Luy2, Christoph Zechner3 (1. Nihon Synopsys G.K., 2. Synopsys Denmark, 3. Synopsys GmbH)
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*Tarun Samadder1, Souvik Mahapatra1 (1. IIT Bombay)
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*Juho Lee1, Seunghyun Kim2, Hyoseok Kim1, Myung Hun Woo2, Joo Heon Kang2, Hyun-Mog Park2, Sungduk Hong1, Sung Jin Kim1, Daewon Ha2, Dae Sin Kim1 (1. Computational Science & Enginnering, Samsung Electronics, 2. Advanced Device Research, Semiconductor R&D Center, Samsung Electronics)
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Vivek Saraswat1, Arpan De2, *Jayatika Sakhuja1, Udayan Ganguly1,3 (1. Department of Electrical Eng., Indian Inst. Of Tech. Bombay, 2. Department of Electronics and Telecommunication Eng., Jadavpur Univ., 3. IITB Centre for Semiconductor Tech. (SEMIX))
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*Chang Su1, Ning Feng3, Kaifeng Wang1, Lining Zhang3, Ru Huang1,2, Qianqian Huang1,2 (1. School of Integrated Circuits, Peking University, 2. Beijing Advanced Innovation Center for Integrated Circuits, 3. School of Electronic and Computer Engineering, Peking University)
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*Pengying Chang1, Yirong Guo1, Jie Li1, Yiyang Xie1 (1. Beijing University of Technology)
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*Wanwang Yang1, Chenxi Yu1, Fei Liu1, Jinfeng Kang1 (1. Peking Univ.)
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*Md Hasan Raza Ansari1, Nazek El Atab1 (1. King Abdullah University of Science and Technology )
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*Fikru Adamu-Lema1, Tapas Dutta1, Meng Duan2, Djamel Bensouiah2, Asen Asenov2,1 (1. University of Glasgow, 2. Semiwise Ltd)
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*In Ki Kim1, Seung-Cheol Han1, Geonho Park1, Geon-Tae Jang1, Sung-Min Hong1 (1. Gwangju Institute of Science and Technology)
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*Hiu Yung Wong1, Hideki Takeuchi2, Robert J. Mears2 (1. San Jose State University, 2. Atomera, Inc.)
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*Ali Rezaei1, Nikolas Xeni1, Naveen Kumar1, Tapas Dutta1, Ismail Topaloglu1, Preslav Alexandrov1, Vihar Petkov Georgiev1, Asen Asenov1 (1. University of Glasgow)
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*Lee-Chi Hung1, Zlatan Stanojevic1, Chen-Ming Tsai1, Markus Karner1, Edward Chen2 (1. Global TCAD Solutions GmbH, 2. Corporate Research, Taiwan Semiconductor Manufacturing Company Ltd.)
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*Meng Yin1, Xiangyu Qiao1, Ken Suzuki2, Hideo Miura3, Lei Wang4 (1. Dept. of Finemechanics, Tohoku Univ., 2. Green X-tech Center, Green Goals Initiative, Tohoku Univ., 3. Fracture and Reliability Research Inst., Tohoku Univ., 4. Dept. of Physics, Univ. of Science and Technology Beijing)
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*Takuya Ishibashi1, Satofumi Souma1 (1. Kobe University)
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*Guohui Zhan1,2, Kun Luo1, Ruoran Jia3, Christopher Yang3, Zhenhua Wu1,2 (1. Inst. of microelectronics, Chinese Academy of Science., 2. Univ. of Chinese Academy of Sciences, 3. ChangXin Memory Technologies, Inc.)
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*Mathias Pech1, Dirk Schulz1 (1. TU Dortmund)
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*Jieun Lee1, Jong Min Kim1, Myeong Bum Pyun1, Won Kook Cho1, Kwang Young Ko1, Hyunchul Nah1 (1. DB Hitek. Co., Ltd.)
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*Valmir Ganiu1, Dirk Schulz1 (1. TU Dortmund)
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*Tobias Linn1, Jan Flasskamp1, Christoph Jungemann1 (1. RWTH Aachen Univ.)
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Max Renner1, *Tobias Linn1, Christoph Jungemann1 (1. RWTH Aachen Univ.)
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*Haoqing Xu1,2, Guohui Zhan1,2, Shixin Li1,2, Jiahao Wu3,2, Kun Luo1, Yu Liu4, Chao He 5, Zhenhua Wu1,2 (1. Inst. of Microelectronics, Chinese Academy of Sciences, 2. Univ. of Chinese Academy of Sciences, 3. Inst. of Computing Technology, Chinese Academy of Sciences, 4. Inspur Group Corp. Ltd. 5. HiSilicon Technology Co., Ltd.)
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Matthew Eng1, *Hiu Yung Wong1 (1. San Jose State University)
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Julián García Fernández1, *Guéric Etesse2, Enrique Comesaña3, Natalia Seoane1, Xiangyu Zhu4, Kazuhiko Hirakawa4,5, Antonio García-Loureiro1, Marc Bescond2,4 (1. CiTIUS, University of Santiago de Compostela, 2. Aix Marseille Université, CNRS, IM2NP UMR 7334, 3. Escola Poliécnica Superior de Enxeñaría, University of Santiago de Compostela, 4. Institute of Industrial Science, University of Tokyo, 5. LIMNS-CNRS, IRL 2820)
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*Yun Dei1, Ya-Shu Yang1, Yiming Li1 (1. National Yang Ming Chiao Tung Univ.)
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*Chanwoo Park1, Jongwook Jeon1,2, Hyunbo Cho1 (1. Alsemy Inc., 2. Sungkyunkwan Univ.)
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