SISPAD2023

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Oral

[Session 1] Thermal/Mechanical Simulations

Wed. Sep 27, 2023 1:00 PM - 2:50 PM Hall A

Chair: Junichi Hattori (AIST), Kentaro Kukita (Kioxia)

2:30 PM - 2:50 PM

[Session_1-05] Full Chip Stress Model for Flash BEOL Crack Failure Risk Analysis

*Kyungmi Yeom1, Geunsang Yoo1, Anthony Payet2, Alexander Schmidt1, Hyoshin Ahn1, Inkook Jang1, Yutaka Nishizawa2, Masaru Uchiyama2, Yasuyuki Kayama2, Satoru Yamada2, Dae Sin Kim1 (1. CSE Team, Innovation Center, Samsung Electronics, 2. DSRJ)

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