SISPAD2023

Presentation information

Oral

[Session 5] Interface and Reliability/Variability

Thu. Sep 28, 2023 9:00 AM - 11:30 AM Hall A

Chair: Hiu-Yung Wong (San Jose State Univ.), Nobuhiko Nakano (Keio Univ.)

10:50 AM - 11:10 AM

[Session_5-05] Effect of Metal Coupling on Schottky Barrier Height Extraction

Sheng-Kai Su1, Edward Chen1, Alfonso Sanchez-Soares2, Thomas Kelly2, Giorgos Fagas2,4, *James C. Greer2,5, Gregory Pitner 3, H.-S. Philip Wong1,6, Iuliana P. Radu1 (1. TSMC, Hsinchu, Taiwan, 2. EOLAS Designs Ltd, 3. TSMC, San Jose, USA, 4. Tyndall Nat'l Inst., Univ. College Cork, 5. Electrical and Electronic Engineering Department, Univ. of Nottingham Ningbo China, 6. Department of Electrical Engineering, Stanford Univ.)

Abstract password authentication.
Password is required to view the abstract. Please enter a password to authenticate.

Password