2017 International Conference on Solid State Devices and Materials

Greeting

On behalf of the Organizing Committee, it is my great pleasure to welcome you to Sendai, Japan, for the 2017 International Conference on Solid State Devices and Materials (SSDM2017). The SSDM Conference series has been contributing to the promotion of science and technology related to solid-state electronics in the past 49 years. A particular feature of SSDM is to cover a diverse range from semiconductor devices and related physics, material science and process technologies to circuits, systems and new technologies such as nano, organic, spin and bio devices. Through SSDM, we have witnessed a number of globally recognized scientific achievements and technical developments, leading to innovation that shaped the society we see today.

This year, 641 high-quality abstracts were submitted to SSDM2017 from 19 countries; the abstracts were almost evenly distributed over 15 technical areas. The final program includes 3 plenary talks, 67 invited papers, 257 contributed oral papers, 168 posters, and 60 late-news papers. I am grateful to the Program Committee for putting together such an exciting program you find in this booklet. We organizers are fully confident that the papers at SSDM2017 address in depth all the key facets in the field and provide you an excellent cross-section of what is happening and what is going to happen in the near future.

The first plenary talk of this year is by Mr. Tetsuro Higashi, Tokyo Electron Limited. Based on his 40 years of tenure, Mr. Higashi will tell us about his reflection and foresight on the semiconductor industry; what has changed and what has not. Then Dr. Pushkar Ranade of Intel Corporation will address the next generation computing from the semiconductor perspective, followed by Professor Takashi Matsuoka of Tohoku University who will discuss about the nitride semiconductor electronics. These two technical plenary talks will give us overviews as well as insights of the two important fields that SSDM covers, computing and lighting/power electronics.

On behalf of all who have been involved in the organization of SSDM2017, I would like to express my sincere appreciation to all the contributors who share their latest results as well as ideas in their presentations to make SSDM2017 so stimulating and exciting. We also express our sincere gratitude for the financial support provided by MEXT-JSPS as well as by the supporting corporations and foundations.

Finally, I thank you for participating in SSDM2017. Enjoy the program of SSDM2017, and I hope you still have time to relish the local atmosphere of the City of Sendai.

 
September 2017
Hideo Ohno
General Chair, Organizing Committee, SSDM2017
Tohoku University