2017 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

02: Interconnect Technologies, MEMS, and Reliability

[H-3] Bump Interconnect

Thu. Sep 21, 2017 9:30 AM - 11:20 AM Meeting Room 6 (Conference building 3F, Sendai International Center)

Session Chair: S. Ogawa(AIST), J. M. Song(National Chung Hsing Univ.)

9:30 AM - 10:00 AM

[H-3-01 (Invited)] Effect of Metallization on the Microstructural Evolution of Microbump under Electric Current Stressing

C. -W. Chen1,K. -L. Lin1 (1.National Cheng Kung Univ. (Taiwan))

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