2017 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

Joint Session (Area 2&7)

[H-6] Optical Interconnects and Sensors

Fri. Sep 22, 2017 11:15 AM - 12:30 PM Meeting Room 6 (Conference building 3F, Sendai International Center)

Session Chair: M. Fujino(Univ. of Tokyo), F. Boeuf(STMicroelectronics)

11:15 AM - 11:45 AM

[H-6-01 (Invited)] Heterogeneous Integration Based on Low-Temperature Bonding for Advanced Optoelectronic Devices

E. Higurashi1,2 (1.AIST (Japan), 2.Univ. of Tokyo (Japan))

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