2018 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[G-4] Advanced Bonding

Wed. Sep 12, 2018 10:45 AM - 11:45 AM Room 231 (School of Engineering Bldg.2 North Wing third floor)

Session Chair: H. Kitada (Fujitsu Labs. Ltd.), J.M. Song (National Chung Hsing Univ.)

10:45 AM - 11:15 AM

[G-4-01 (Invited)] Low Temperature and Non-Vacuum Surface Modification for Robust Hybrid Bonding

A. Shigetou1, T.H.-W. Yang2, R. Kao1 (1.NIMS (Japan), 2.National Taiwan Univ. (Taiwan))

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