Electronic, Thermal, and Unconventional Applications of 2D Materials

E. Pop

doi:https://doi.org/10.7567/SSDM.2018.N-1-01

2:00 PM - 2:30 PM

[N-1-01 (Invited)] Electronic, Thermal, and Unconventional Applications of 2D Materials

^○E. Pop¹, K. Smithe¹, E. Yalon¹, C. English¹, S. Suryavanshi¹, M. Mleczko¹, A. Gabourie¹, C. McClellan¹, M.M. Rojo¹, S. Vaziri¹, I. Datye¹, C. Bailey¹, V. Chen¹, M. Chen¹, A. Sood¹, A. Yu¹, K. Schauble¹, R. Grady¹ (1.Stanford Univ. (USA))

https://doi.org/10.7567/SSDM.2018.N-1-01

2018 International Conference on Solid State Devices and Materials

[N-1-01 (Invited)] Electronic, Thermal, and Unconventional Applications of 2D Materials