2019 International Conference on Solid State Devices and Materials

Sessions

Oral Presentation

68 results  (41 - 50)

  • Oral Presentation
  • | 02: Advanced / Emerging Memories and New Applications

Thu. Sep 5, 2019 9:00 AM - 10:15 AM IB011 (IB 1F)

Session Chair: N. Takaura (Hitachi, Ltd.), K. Yamamoto (Toshiba Memory Corp.)

  • Oral Presentation
  • | 02: Advanced / Emerging Memories and New Applications

Thu. Sep 5, 2019 10:30 AM - 11:45 AM IB011 (IB 1F)

Session Chair: N. Takaura (Hitachi, Ltd.), I. Kataeva (DENSO Corp.)

  • Oral Presentation
  • | 02: Advanced / Emerging Memories and New Applications

Thu. Sep 5, 2019 1:00 PM - 2:30 PM IB011 (IB 1F)

Session Chair: H. Sato (Tohoku Univ.), M. H Lee (Macronix International Co., Ltd.)

  • Oral Presentation
  • | 03: Interconnect / 3D Integrations / MEMS

Tue. Sep 3, 2019 2:00 PM - 3:45 PM IB013 (IB 1F)

Session Chair: M. Ueki (Sony Semiconductor Manufacturing Corp.), M.B. Takeyama (Kitami Inst. of Tech.)

  • Oral Presentation
  • | 03: Interconnect / 3D Integrations / MEMS

Tue. Sep 3, 2019 3:45 PM - 4:45 PM IB013 (IB 1F)

Session Chair: J. De Messemaeker (imec), T. Nogami (IBM Research)

  • Oral Presentation
  • | 03: Interconnect / 3D Integrations / MEMS

Thu. Sep 5, 2019 9:00 AM - 10:15 AM IB013 (IB 1F)

Session Chair: M. Kodera (Moses Lake Industries, Inc.), M. Mariappan (Tohoku Univ.)

  • Oral Presentation
  • | 04: Power Devices / High-speed Devices, and Materials

Tue. Sep 3, 2019 2:00 PM - 3:30 PM IB014 (IB 1F)

Session Chair: K. Tsuda (Toshiba Infrastructure Systems & Solutions Corp.), M. Yanagihara (Panasonic Corp.)

  • Oral Presentation
  • | 04: Power Devices / High-speed Devices, and Materials

Wed. Sep 4, 2019 9:00 AM - 10:30 AM IB014 (IB 1F)

Session Chair: T. Terashima (Mitsubishi Electric Corp.), T. Matsudai (Toshiba Electronic Devices & Storage Corp.)