2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[J-1] Advanced Interconnects

Tue. Sep 3, 2019 2:00 PM - 3:45 PM IB013 (IB 1F)

Session Chair: M. Ueki (Sony Semiconductor Manufacturing Corp.), M.B. Takeyama (Kitami Inst. of Tech.)

2:30 PM - 3:00 PM

[J-1-02 (Invited)] Opportunities and Challenges of Atom Switch for Next AI Hardware

M. Tada1, T. Sakamoto1, M. Miyamura1 (1.NEC Corp. (Japan))

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