2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[J-2] 3D Integration I

Tue. Sep 3, 2019 3:45 PM - 4:45 PM IB013 (IB 1F)

Session Chair:J. De Messemaeker(IMEC), T. Nogami(IBM Research)

3:45 PM - 4:15 PM

[J-2-01 (Invited)] Size-Reduction of HBW System using WOW Bumpless TSV Interconnects

T. Ohba1 (1. Tokyo Tech(Japan))