2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[J-6] Compound Semiconductors and Printing Technologies

Thu. Sep 5, 2019 10:30 AM - 12:00 PM IB013 (IB 1F)

Session Chair:T. Minari(NIMS), K. Shiojima(Univ. of Fukui)

10:30 AM - 11:00 AM

[J-6-01 (Invited)] Metallization Technology for High Current Density and High Temperature Operation Power Modules

K. Sugiura1, T. Iwashige1, K. Tsuruta1, Y. Sakuma2, Y. Oda3, C. Chen4, S. Nagao4, T. Sugahara4, K. Suganuma4 (1. DENSO CORP.(Japan), 2. C.Uyemura & Co.,Ltd., Techinical Support Group(Japan), 3. C.Uyemura & Co.,Ltd., Central Research Laboratory(Japan), 4. Osaka Univ.(Japan))