2019 International Conference on Solid State Devices and Materials

Presentation information

Oral Presentation

Joint Session(Area1&3&SP)

[M-3] Advanced Integration Technologies

Wed. Sep 4, 2019 9:00 AM - 10:30 AM IB015 (IB 1F)

Session Chair: H. Majima (Toshiba Electronic Devices & Storage Corp.), M. Ueki (Sony Semiconductor Manufacturing Corp.)

9:30 AM - 9:45 AM

[M-3-02] 3D SoC Design with TSV-less Power Supply Employing Highly Doped Silicon Via

K. Shiba1, M. Hamada1, T. Kuroda1 (1.Keio Univ. (Japan))

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