The Japan Society of Applied Physics

9:45 AM - 10:00 AM

[M-3-03] 2.5D Integration Using Inductive-Coupling TSV-less Miniature Interposer Achieving 317Gb/s/mm2, 1.2pJ/b Data Transfer

C. Cheng1, K. Shiba1, M. Hamada1, T. Kuroda1 (1.Keio Univ. (Japan))

https://doi.org/10.7567/SSDM.2019.M-3-03