2020 International Conference on Solid State Devices and Materials

Presentation information

Oral presentation

01: Advanced CMOS: Material Fundamentals / Process Science / Device Physics

[A-3] 3D Integration and Device Characterization

Tue. Sep 29, 2020 9:00 AM - 10:30 AM Room A

Session Chair: Nobuyuki Mise (Hitachi High-Tech Corp.), Fu-Liang Yang(Academia Sinica)

9:00 AM - 9:30 AM

[A-3-01 (Invited)] Materials and Layer Transfer Process Technologies for Heterogeneous 3D Integration of Germanium on Silicon

〇Willy Rachmady1 (1. Intel Corporation(United States of America))

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