2020 International Conference on Solid State Devices and Materials

Presentation information

Oral presentation

03: Interconnect / 3D Integrations / MEMS

[C-4] Advanced Interconnects & 3D Integration III

Tue. Sep 29, 2020 11:00 AM - 12:30 PM Room C

Session Chair: Takeyasu Saito (Univ. of Osaka Prefecture), Yukiyasu Kashiwagi (Osaka Research Inst. of Industrial Sci. and Tech.)

11:00 AM - 11:30 AM

[C-4-01 (Invited)] 3D-IC technology in the era of AI, IoT and Big data

〇Katsuya Kikuchi1 (1. AIST(Japan))

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