〇Mathias Rommel¹, Tobias Erlbacher¹ (1. Fraunhofer Inst. for Integrated Systems and Device Tech. IISB (Germany))

〇Kuan Yew Cheong¹, Xiufei Hu², Ming Li², Yingnan Wang², Yan Peng², Gongbin Tang², Mingsheng Xu², Xiangang Xu², Jisheng Han², Xiwei Wang², Bin Li², Yiqiu Yang² (1. Universiti Sains Malaysia (Malaysia), 2. Shandong Univ. (China))

〇Mayu Ueda¹, Kyosuke Hayasaka¹, Kyotaro Kanehisa¹, Yasuhiro Takahashi¹, Chiyuki Wakabayashi¹, Taisuke Kageura², Hiroshi Kawarada^1,3 (1. Waseda Univ. (Japan), 2. National Inst. of Advanced Indus. Sci. and Tech. (Japan), 3. Kagami Memorial Res. Inst. for Materials Sci. and Tech. (Japan))

〇Rie Yamada¹, Atsushi Sekiguchi¹, Takeyoshi Onuma¹, Tohru Honda¹, Tomohiro Yamaguchi¹ (1. Univ. of Kogakuin (Japan))

〇Haruka Sokudo¹, Toru Akiyama¹, Tomonori Ito¹ (1. Univ. of Mie (Japan))