Oral Presentation
03: Interconnect / 3D Integrations / MEMS
Wed. Sep 28, 2022 1:30 PM - 3:30 PM 304 (3F)
Session Chair: Shigeo Yasuhara (Japan Advanced Chemicals Ltd.), Kenji Shiojima (Univ. of Fukui)
1:30 PM - 2:00 PM
〇Takashi Hayakawa1 (1. TEL (Japan))
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2:00 PM - 2:15 PM
〇Keisuke Wakamoto1,2, Takukazu Otsuka1, Ken Nakahara1, Takahiro Namazu2 (1. Rohm Co., Ltd (Japan), 2. Kyoto University of Advanced Science (Japan))
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2:15 PM - 2:30 PM
〇Jinhyun Choe1, Jinseok Kim1, Dawon Ahn1, Eunsu Jung1, Sunggyu Pyo1 (1. Chung-Ang University (Korea))
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2:30 PM - 2:45 PM
〇Koki Ono1, Takashi Koide1, Yong Jin2, Yuuki Tsutiizu1, Takuhiro Hasegawa1, Shigeo Yasuhara2, Wakana Takeuchi1 (1. Aichi Institute Technology (Japan), 2. Japan Advanced Chemicals Ltd. (Japan))
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2:45 PM - 3:00 PM
〇Takeyasu Saito1, Kazunobu WAKAMATSU1, Kazuki UEDA1, Naoki OKAMOTO1 (1. Osaka Metropolitan Univ. (Japan))
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3:00 PM - 3:15 PM
〇Stephane LARIVIERE1, Stefan DECOSTER1, Sara PAOLILLO1, Vincent RENAUD1, Diana TSVETANOVA1, Bart KENENS1, Hanne DE COSTER1, Quoc Toan LE1, Yusuke ONIKI1, Alfonso SEPULVEDA MARQUEZ1, Karen STIERS1, Felix SEIDEL1, Martin O'TOOLE1, Mircea DUSA1, Kurt RONSE1, Chris WILSON1 (1. imec (Belgium))
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3:15 PM - 3:30 PM
〇Ben Daniel Rowlinson1, Omesh Kapur1, Dongkai Guo1, Ruomeng Huang1, C.H. de Groot1, Harold Chong1 (1. University of Southampton (UK))
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