5:15 PM - 5:30 PM
[F-3-04] Electrical Assessment of Scaled HfO2-Based BEOL-Integrated FTJs Leading to Multi-Level Capability Demonstration
Presentation style: On-site (in-person)
CMOS compatible TiN/HfO2:Si/Al2O3/TiN Ferroelectric Tunnel Junctions (FTJs) integrated in a 130nm Back-End of Line (BEOL) process are reported. FTJ device operation de-pendence on cycling conditions is assessed. Switching kinetic of FTJ is then studied and yields to the successful programming of four read-disturb-free conductance levels. These results confirm the potential of bilayer FTJs for scalability and future neuromorphic applications.
