2022 International Conference on Solid State Devices and Materials

Presentation information

Print

Oral Presentation

03: Interconnect / 3D Integrations / MEMS

[K-4] Design, Process, and Technology for High-performance Chiplet II/3D Integration and Advanced Packaging II

Wed. Sep 28, 2022 9:00 AM - 10:15 AM 304 (3F)

Session Chair: Takeyasu Saito (Osaka Metropolitan Univ.), Xun Gu (ASM Japan)

9:00 AM - 9:30 AM

[K-4-01 (Invited)] Heterogenous Integration on Flexible Substrates

〇Subramanian S. Iyer1 (1. ULCA (United States of America))

Presentation style: Online

https://doi.org/10.7567/SSDM.2022.K-4-01

Abstract password authentication.
Password to download abstracts has been informed in the confirmation mail.

Password